Soldering with no-clean flux
is a viable alternative for eliminating the laborious post solder cleaning
using costly and polluting CFC solvent cleaning.
To eliminate cleaning, the
flux and soldering process must:
a) Bind effectively to make sound solder joints
b) Leave minimal amount of residue after soldering
c) Have left over residue which is translucent, aesthetically acceptable and non-tacky that will not interfere in any in-circuit testing, automated pin testing or bed-of-nails testing.
d) Have left over residue that will not react with the circuit or components and will stay inert and not be influenced by changes in temperature, humidity or fluctuations in voltage.
e) Be economic and practically feasible.
a) Bind effectively to make sound solder joints
b) Leave minimal amount of residue after soldering
c) Have left over residue which is translucent, aesthetically acceptable and non-tacky that will not interfere in any in-circuit testing, automated pin testing or bed-of-nails testing.
d) Have left over residue that will not react with the circuit or components and will stay inert and not be influenced by changes in temperature, humidity or fluctuations in voltage.
e) Be economic and practically feasible.
We offer specially formulated
no-clean fluxes that meet the above conditions, and are suitable for a variety
of applications.
No Clean Flux are low
solid (less than 5%) fluxes, specially developed for SMDs and mixed technology
soldering. They are completely non-halide, show outstanding solderability on
all types of board including SMDs, give excellent wetting on surface mounted
components, and leave no visible flux residue after soldering. Often no further
cleaning is required, but if very high ionic cleanliness is needed, the residue
can be removed by solvent or saponification cleaning. These fluxes are
J-STD-004 compliant.
No-clean fluxes with solid content less than 3% are also available for use in foam flux operations as well as application by dipping, brushing or spraying.
No-clean fluxes with solid content less than 3% are also available for use in foam flux operations as well as application by dipping, brushing or spraying.
Those with solid content less than 2.2% have been developed to meet industry's need for high speed automation and high reliability. The small amount of residue is non-corrosive (meets IPC and J STD requirements) and tack free (meets Bell Core specification).
We also have a low solid-2%- flux, that is halide free, no-resin, no rosin flux, for soldering through hole, mixed technology, surface mount and solar panel assemblies. It can be applied by spray, dip and foam equipment. It meets ANSI / IPC SF-818 Assembly Class 3, SIR requirements.
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